Ⅰ、HOC 6101 series
Resist Film Thickness:1.5-7um
Property:
1. Low curing temperature(60℃)
2. High transmittance(T%>98)
3. Low consumption(low film thickness)
4. High temperature resistant laser cutting
5. Acid recasting resistant
6. Low alkalinity solution stripping
Ⅱ、Application Fields：
1. Stealth Laser Dicing：
For ultra-thin silicon memory chips, CIS sensors and WLCSP advanced packaging. It provides thermal insulation and prevents circuit delamination.
2. UV Laser Ablation Scribing：
Suitable for SiC, GaN, sapphire LED wafers, glass and compound semiconductors. It effectively absorbs massive high-temperature molten residues.
3. Laser Blind Trench & Isolation Grooving：
Applied to TSV wafers, isolation trenches for power chips and RF substrates, restraining carbonization of metal at trench openings.
4. Combined Laser Dicing & Plasma Process：
For automotive-grade SiC devices and high-end optical communication chips. The protective coating features excellent plasma resistance and can be fully cleaned off via water washing without residues.
