Transparent OC Photoresist

Developed by the Electronic Chemicals Division of Everlight Chemical, the EOC (Over Coat) series is a negative transparent insulating protective photoresist tailored for display panel applications. Leveraging over a decade of technical expertise and a comprehensive product portfolio, the series features mature low-temperature curing solutions optimized for advanced flexible displays.EOC photoresist is widely used for structural protection and electrical isolation in touch panels and AMOLED scree

产品详情

Ⅰ、EOC 225 series

Resist Film Thickness:1.5-3um

Property:

1.  Refractive index (1.70);

2. Transmittance (550 nm,95%);

3. Good adhesion after stripping resistance test;

4. Good adhesion after etching resistance test;

5. Good adhesion after moistures resistance test.


Ⅱ、Application Fields:

1. Touch Panel (Core Application):

As one of the essential materials for projected capacitive touch panels, EOC photoresist is compatible with On-Cell and In-Cell integration technologies and is widely adopted in smartphones and tablet devices.


2. AMOLED Display Panel:

It functions as the insulating layer and pixel defining layer in AMOLED manufacturing. To meet flexible display requirements, low-temperature curing EOC products are primarily utilized to prevent cracking of the insulating protective layer during screen folding and bending.


3. Micro LED Display:

In next-generation Micro LED technology, EOC photoresist serves as a planarization layer to stabilize pixel electrical performance and ensure consistent and high-quality display effects.


4. Automotive Display:

The EOC series supports the production of large-size, high-resolution automotive display screens, enabling high-transparency OC photoresist solutions and Micro LED head-up display (HUD) applications for vehicles.


5. Emerging Display and Sensing Applications:

It is applied for the planarization and protection of thin-film transistor (TFT) arrays. For LED sensor devices, it provides excellent light transmittance, stable surface resistance, and reliable adhesion to silicon wafers.


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